Effect of three-dimensional current and temperature distributions on void formation and propagation in flip-chip solder joints during electromigration

نویسندگان

  • S. W. Liang
  • Y. W. Chang
  • T. L. Shao
  • Chih Chen
چکیده

Articles you may be interested in Influence of Cu column under-bump-metallizations on current crowding and Joule heating effects of electromigration in flip-chip solder joints Effect of void propagation on bump resistance due to electromigration in flip-chip solder joints using Kelvin structure Appl. Investigation of void nucleation and propagation during electromigration of flip-chip solder joints using x-ray microscopy Appl.

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تاریخ انتشار 2014